Automatic Final Vision Inspection for
IC Package substrate.
![PINE](http://www.ati2000.co.kr/wordpress/wp-content/uploads/2018/05/PINE.png)
- Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non-SOP)
- Multiple handling of various sizes of products (W)40~120mm, (L)100~300mm, (T)0.06mm and 1.50mm
- High throughput with color processing
![PINE Inspection Items](http://www.ati2000.co.kr/wordpress/wp-content/uploads/2018/05/PINE-Inspection-Items-1024x468.png)