Automatic Final Vision Inspection for
IC Package substrate.

  • Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non-SOP)
  • Multiple handling of various sizes of products (W)40~120mm, (L)100~300mm, (T)0.06mm and 1.50mm
  • High throughput with color processing