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  • IC Package Substrate AFVI

1800

- As Industry Standard AFVI, Available for Various Substrate
  Products.
- Available for 2um~5.5um Resolution depends on Substrate
  Product Model.


▪ Inspection Object :
  - BOC, CSP, UTC, SiP, PBGA, MMC,
  - FC-CSP (Non SOP Type), BOL
  - FC-CSP (SOP Type, Magazine & Interleaf Handling)
▪ Surface : Soft Au, ENIG, OSP(=Flux), Hard Gold
▪ Interleaf Handling (AVIS-1800Plu)
▪ Magazine Loader / Unloader
  (AVIS-1800PM, AVIS-1800PMP)